Software system for semiconductor devices, monolith and hybrid IC´s thermal analysis

Author

Anc, K. O Petrosj ; Kharitonov, I.A. ; Rybov, N.I. ; Maltcev, P.P.

Author_Institution

Moscow Univ. of Electron. & Math., Russia

fYear

1995

fDate

18-22 Sep 1995

Firstpage

360

Lastpage

365

Abstract

A three level software system for thermal analysis of semiconductor devices, one-chip monolith IC´s, multi-chip modules (MCM) and hybrid IC´s is presented. For each design level the 3D temperature simulators are described to analyze the steady state and transient thermal behavior and connect the design results with the device and/or IC layout and packaging constructions. Practical examples are discussed illustrating the possibilities of developed techniques and software tools

Keywords

circuit analysis computing; circuit layout CAD; hybrid integrated circuits; integrated circuit layout; integrated circuit modelling; monolithic integrated circuits; multichip modules; temperature distribution; thermal analysis; 3D temperature simulators; hybrid ICs thermal analysis; monolith thermal analysis; multi-chip modules; packaging constructions; semiconductor device thermal analysis; software system; steady state thermal behavior; transient thermal behavior; Analytical models; Hybrid integrated circuits; Integrated circuit layout; Integrated circuit packaging; Monolithic integrated circuits; Semiconductor devices; Software systems; Steady-state; Temperature; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Design Automation Conference, 1995, with EURO-VHDL, Proceedings EURO-DAC '95., European

Conference_Location

Brighton

Print_ISBN

0-8186-7156-4

Type

conf

DOI

10.1109/EURDAC.1995.527430

Filename

527430