• DocumentCode
    354322
  • Title

    Multi-layer spiral inductors in a high-precision, fully-planar MCM-D process

  • Author

    Gouker, M. ; Konistis, K. ; Knecht, J. ; Kushner, L. ; Travis, L.

  • Author_Institution
    Lincoln Lab., MIT, Lexington, MA, USA
  • Volume
    2
  • fYear
    2000
  • fDate
    11-16 June 2000
  • Firstpage
    1055
  • Abstract
    The precision MCM process described in this paper has several performance enhancing features not found in other reported MCM processes. The process enables the fabrication of inductors with orders of magnitude greater inductance than other packaging techniques for the same area on the MCM.
  • Keywords
    MMIC; inductance; inductors; integrated circuit packaging; multichip modules; area; fully-planar MCM-D process; inductance; inductors; multi-layer spiral inductors; packaging techniques; precision MCM process; Capacitors; Circuit testing; Dielectrics; Fabrication; Inductors; Integrated circuit technology; Laboratories; Resistors; Silicon compounds; Spirals;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest. 2000 IEEE MTT-S International
  • Conference_Location
    Boston, MA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-5687-X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2000.863538
  • Filename
    863538
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=354322