A multi-physics simulation technique for integrated MEMS

Author

Toshiyoshi, Hiroshi ; Konishi, Tsuyoshi ; Machida, Kenji ; Masu, Kazuya

Author_Institution

Res. Center for Adv. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan

fYear

2012

fDate

10-13 Dec. 2012

Abstract

We have developed a multi-physics simulation platform for microelectromechanical systems (MEMS) on a spice-based circuit simulator (LTspice) and by interpreting the analytical models for electromechanical components such as electrostatic parallel-plate actuator, viscoelastic spring, and mechanical anchor by using behavioral current/voltage sources. The Kernel solver for the mechanical equation of motion (EOM) has been programmed by simply using the integral function of the LTspice mathematic library. Simulation capability has been extended to and tested against the electrostatic digital torsion mirror device integrated with CMOS level shifter circuit.

Keywords

CMOS integrated circuits; SPICE; micromechanical devices; CMOS level shifter circuit; EOM; LTspice mathematic library; SPICE-based circuit simulator; behavioral current-voltage sources; electrostatic digital torsion mirror device; electrostatic parallel-plate actuator; integral function; integrated MEMS; kernel solver; mechanical anchor; mechanical equation of motion; microelectromechanical systems; multiphysics simulation technique; viscoelastic spring; Electrostatics; Force; Integrated circuit modeling; MOS devices; Mathematical model; Micromechanical devices; Mirrors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting (IEDM), 2012 IEEE International

Conference_Location

San Francisco, CA

ISSN

0163-1918

Print_ISBN

978-1-4673-4872-0

Electronic_ISBN

0163-1918

Type

conf

DOI

10.1109/IEDM.2012.6478989

Filename

6478989