DocumentCode
3544521
Title
High voltage solid dielectric coaxial ferrimagnetic Nonlinear Transmission Line
Author
Reale, Diego ; Bragg, James-William B. ; Solarski, Richard ; Neuber, A. ; Holt, Shad ; Mankowski, J. ; Dickens, J.
Author_Institution
Center for Pulsed Power & Power Electron., Texas Tech Univ., Lubbock, TX, USA
fYear
2013
fDate
16-21 June 2013
Firstpage
1
Lastpage
1
Abstract
Previously developed coaxial ferromagnetic Nonlinear Transmission Lines (NLTL) relied solely on pressurized Sulfur Hexaflouride (SF6) as high-voltage insulating dielectric medium [1]. While the use of SF6 provides the necessary electric insulation, there are drawbacks including gas storage and pressure fittings that increase system size and add to the design complexity of the NLTLs themselves. We evaluate solid dielectric materials as an alternative. Initial attempts used a standard high voltage (HV) epoxy to pot the NLTL assembly. This method was effective at producing magnetic precession in the NLTL; however, there was a reduction in output power due to the high loss tangent of the epoxy. Sylgard 184, commonly used in solar cells, has been widely used as an HV potting material and has an order of magnitude lower loss tangent than standard HV epoxy at 1 kHz. Samples of HV epoxy and Sylgard 184 are tested in a microwave cavity resonator at 3 GHz to determine their loss tangents. The performance of an NLTL potted with Sylgard 184 is compared to that of the HV epoxy NLTL and the current SF6 insulated NLTL.
Keywords
SF6 insulation; cavity resonators; ferroelectric materials; transmission lines; HV potting material; NLTL; Sylgard 184; frequency 3 GHz; gas storage; high voltage solid dielectric coaxial ferrimagnetic nonlinear transmission line; high-voltage insulating dielectric medium; microwave cavity resonator; pressure fittings; pressurized sulfur hexaflouride; solar cells; solid dielectric materials; standard HV epoxy; Dielectrics; Power electronics; Power transmission lines; Solids; Standards; Sulfur hexafluoride;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science (ICOPS), 2013 Abstracts IEEE International Conference on
Conference_Location
San Francisco, CA
ISSN
0730-9244
Type
conf
DOI
10.1109/PLASMA.2013.6633210
Filename
6633210
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