Noise generation, coupling, isolation, and EM radiation in high-speed package and PCB

Author

Kim, Joungho ; Pak, Junso ; Park, Jongbae ; Kim, Hyungsoo

Author_Institution

EECS Dept., KAIST, Daejon, South Korea

fYear

2005

fDate

23-26 May 2005

Firstpage

5766

Abstract

The return current path is the most critical part of high-speed interconnection design in both package and PCB. When the return current path is disturbed, significant amount of noise generation, coupling, and radiated emission problems occur. Signal vias and power/ground vias produce a return current path disconnect problem. In this paper, we demonstrate that the via is a major source of the SSN (simultaneous switching noise) generation, coupling, and edge radiated emission in multi-layer packages and PCBs.

Keywords

circuit noise; coupled circuits; electromagnetic compatibility; electromagnetic interference; electronics packaging; interconnections; printed circuits; EM radiation; EMI/EMC; PCB; SSN generation; densely spaced interconnection structures; edge radiated emission; high-speed interconnection; high-speed packages; isolation; multilayer packages; noise coupling; noise generation; power/ground vias; radiated emission; return current path disconnect problem; signal vias; simultaneous switching noise generation; Circuit noise; Communication switching; Integrated circuit interconnections; Noise generators; Packaging; Power generation; Resonance; Resonant frequency; Signal generators; Switching circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 2005. ISCAS 2005. IEEE International Symposium on

Print_ISBN

0-7803-8834-8

Type

conf

DOI

10.1109/ISCAS.2005.1465948

Filename

1465948