Methods for searching the cause of crack

Generally, nearly every step in the manufacture of integrated silicon devices will introduce the problem of residual stresses, which will cause crack in the active devices structure. In particular, crack often happens in the wafer saw, die attach, die bond and moulding process. Some crack figure can easily be fixed such as wafer saw induced from chip out at the edge of die. But many dies which fail die crack can´t be explained exactly. In this paper, we will gives some FA cases to explain many confusing crack which is induced in die attach was highly suspected.