DocumentCode
3549748
Title
Ring voids and solder extrusion mechanism for flip chip packaging
Author
Zhao, X.L. ; Chin, J.M. ; Master, Raj N.
Author_Institution
Device Anal. Lab, Adv. Micro Devices (Singapore) Pte Ltd, Singapore
fYear
2005
fDate
27 June-1 July 2005
Firstpage
258
Lastpage
262
Abstract
This paper investigated the factors to cause the formation of underfill voids during dispense and cure of underfill in the flip chip technique. The extrusion mechanism of solder bump has been studied in detail. The experimental results show that additional interim-cure processing is an effective way to eliminate ring voids.
Keywords
curing; extrusion; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; solders; voids (solid); flip chip packaging; integrated circuit interconnections; integrated circuit packaging; ring voids; solder bumps; solder extrusion mechanism; underfill curing; underfill dispensing; underfill voids; Assembly; Fatigue; Flip chip; Lead; Microprocessors; Plastic packaging; Pulp manufacturing; Temperature distribution; Testing; US Department of Energy;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN
0-7803-9301-5
Type
conf
DOI
10.1109/IPFA.2005.1469174
Filename
1469174
Link To Document