Packaging and system integration of microwave and digital monolithic IC´s

Author

Holz, G.L. ; Bugeau, J.L. ; Priolo, M.A.

Author_Institution

Holz Ind. Inc., San Diego, CA, USA

fYear

1991

fDate

10-14 July 1991

Firstpage

1059

Abstract

A single firing, multilayer process which uses a combination of thick- and thin-film metallization on hardened ceramic has been developed. This technology promotes the integration of digital, analog, and microwave circuit designs onto a single multilayer substrate. It provides an increase in interconnect density, a reduction in the number of parts, and a decrease in assembly operations. This packaging approach, known as STRATEDGE, provides greater design flexibility and superior electrical performance for microwave products such as couplers, filters, MMIC modules, delay lines, and millimeter-wave packages.<>

Keywords

MMIC; digital integrated circuits; hybrid integrated circuits; integrated circuit technology; metallisation; packaging; MMIC modules; STRATEDGE; couplers; delay lines; digital monolithic IC; filters; hardened ceramic; interconnect density; millimeter-wave packages; multilayer process; multilayer substrate; packaging; single firing process; system integration; thick film metallisation; thin-film metallization; Ceramics; Circuit synthesis; Firing; Integrated circuit interconnections; Metallization; Microwave technology; Nonhomogeneous media; Packaging; Substrates; Thin film circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1991., IEEE MTT-S International

Conference_Location

Boston, MA, USA

ISSN

0149-645X

Print_ISBN

0-87942-591-1

Type

conf

DOI

10.1109/MWSYM.1991.147196

Filename

147196