DocumentCode
3552400
Title
Secondary breakdown thermal characterization and improvement of semiconductor devices
Author
Reich, B. ; Hakim, E.B.
Volume
11
fYear
1965
fDate
1965
Firstpage
59
Lastpage
59
Abstract
Recent work at this Laboratory has indicated that the energy dependence of semiconductor devices with respect to secondary breakdown can be explained on the basis of transient thermal resistance. A new method of measuring transient thermal resistance in the avalanche mode will be described as well as the resultant characteristics. The results indicate that the thermal time constants of transistors is much shorter than heretofore recognized. A similar exercise will be presented for voltage regulator diodes. In addition, a simple technique will be described which significantly increases the thermal time constant of these devices. Similar changes are envisioned for other semiconductor devices.
Keywords
Electric breakdown; Electrical resistance measurement; Laboratories; Regulators; Semiconductor device breakdown; Semiconductor devices; Semiconductor diodes; Thermal resistance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1965 International
Type
conf
DOI
10.1109/IEDM.1965.187621
Filename
1474202
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