DocumentCode
3553762
Title
CMOS-bipolar monolithic integrated-circuit technology
Author
Polinsk, M.A. ; Schade, O. ; Keller, J.P.
Author_Institution
RCA Solid State Division, Somerville, New Jersey
Volume
19
fYear
1973
fDate
1973
Firstpage
229
Lastpage
231
Abstract
This paper describes a new integrated circuit process in which CMOS and bipolar integrated-circuit technologies have been monolithically mated without compromising the performance characteristics of either the bipolar or the CMOS devices. The approach taken has been the addition of the required steps for fabricating CMOS devices to the basic linear-integrated-circuit process. This approach results in the need for one additional photoresist step over the process used for linear integrated circuits with compensating MOS capacitors. The basic processing steps, including the ion-implantation technique used to form the p-wells for the NMOS devices, are presented and discussed. Typical characteristics of the bipolar and CMOS devices fabricated with this process are shown. An amplifier circuit using this process has been fabricated. PMOS input devices are used along with the bipolar devices that provide the functions of current mirrors and high-gain amplifiers. CMOS devices are used in an inverter output stage.
Keywords
Analog integrated circuits; Bipolar integrated circuits; CMOS integrated circuits; CMOS process; CMOS technology; Integrated circuit technology; MOS capacitors; MOS devices; Monolithic integrated circuits; Resists;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1973 International
Type
conf
DOI
10.1109/IEDM.1973.188694
Filename
1477571
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