DocumentCode
3555614
Title
Electron trapping in SiO2 - An injection mode dependent phenomenon
Author
Eitan, B. ; Frohman-Bentchkowsky, D. ; Shappir, J.
Author_Institution
Intel Corporation, Santa Clara, California
fYear
1981
fDate
7-9 Dec. 1981
Firstpage
604
Lastpage
607
Abstract
Electron trapping in MOS structures and its dependence on the injected electron energy distribution and oxide field were studied. It is found that in high injection level´s trapping efficiency and saturation level increase with the accelerating field in the Si, and decrease with increase in the oxide field. These results differ markedly from those obtained in low level injection, in which it is assumed that trapping is of electrons injected from the Si into the oxide conduction band. Based on the high level injection experimental results, it is proposed that significant electron trapping is obtained through direct tunneling of hot electrons with energy less than the potential barrier, into the localized states in the oxide near Si-SiO2 interface. Confirmation of the location of the trapped electrons is obtained from detrapping measurements and the boron doping concentration effect on trapping.
Keywords
Acceleration; Boron; Doping; Electron devices; Electron traps; MOS devices; P-n junctions; Semiconductor process modeling; Tunneling; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1981 International
Conference_Location
Washington, DC, USA
Type
conf
DOI
10.1109/IEDM.1981.190157
Filename
1482110
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