• DocumentCode
    3555614
  • Title

    Electron trapping in SiO2 - An injection mode dependent phenomenon

  • Author

    Eitan, B. ; Frohman-Bentchkowsky, D. ; Shappir, J.

  • Author_Institution
    Intel Corporation, Santa Clara, California
  • fYear
    1981
  • fDate
    7-9 Dec. 1981
  • Firstpage
    604
  • Lastpage
    607
  • Abstract
    Electron trapping in MOS structures and its dependence on the injected electron energy distribution and oxide field were studied. It is found that in high injection level´s trapping efficiency and saturation level increase with the accelerating field in the Si, and decrease with increase in the oxide field. These results differ markedly from those obtained in low level injection, in which it is assumed that trapping is of electrons injected from the Si into the oxide conduction band. Based on the high level injection experimental results, it is proposed that significant electron trapping is obtained through direct tunneling of hot electrons with energy less than the potential barrier, into the localized states in the oxide near Si-SiO2interface. Confirmation of the location of the trapped electrons is obtained from detrapping measurements and the boron doping concentration effect on trapping.
  • Keywords
    Acceleration; Boron; Doping; Electron devices; Electron traps; MOS devices; P-n junctions; Semiconductor process modeling; Tunneling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1981 International
  • Conference_Location
    Washington, DC, USA
  • Type

    conf

  • DOI
    10.1109/IEDM.1981.190157
  • Filename
    1482110