DocumentCode
3556439
Title
High capacitance ultra-thin Ta2 O5 dielectric film applied to a high-speed bipolar memory cell
Author
Nishioka, Y. ; Homma, N. ; Shinriki, H. ; Mukai, K. ; Yamaguchi, K. ; Uchida, A. ; Higeta, K. ; Ogiue, K.
Author_Institution
Hitachi Ltd., Kokubunji, Tokyo, Japan
Volume
31
fYear
1985
fDate
1985
Firstpage
42
Lastpage
45
Abstract
A new capacitor technology, with extremely thin Ta2 O5 film deposition and weakspot oxidation, is developed to realize high capacitance and high reliability. The Ta2 O5 film was reactively sputtered and followed by the weakspot oxidation. The oxidation improves the breakdown voltage by selectively oxidizing Si surface at weakspots where Ta2 O5 is locally thin. Consequently it reduces the defect density of the Ta2 O5 capacitor with least reduction of capacitance. This technology is based on a newly discovered fact that Ta2 O5 film below 200 Å remains in amorphous state with high dielectric breakdown strength even after heat treatments up to 1000 °C. Application of the Ta2 O5 capacitor to a switched-load resistor memory makes it possible to reduce the memory cell area to one third that of a conventional one. The memory provides high speed operation, and has sufficient soft error immunity.
Keywords
Amorphous materials; Capacitance; Capacitors; Dielectric breakdown; Dielectric thin films; Fabrication; Heat treatment; Large scale integration; Oxidation; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1985 International
Type
conf
DOI
10.1109/IEDM.1985.190886
Filename
1485436
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