Experimental verification of a model for the optimization of pin fin heatsinks

Author

Zapach, Trevor ; Newhouse, Todd ; Taylor, Jeff ; Thomasing, Peter

Author_Institution

Nortel Networks, Calgary, Alta., Canada

Volume

1

fYear

2000

fDate

2000

Lastpage

69

Abstract

An analytical model for the optimization of pin fin heatsinks was developed. The model is based on correlations of flow resistance and heat transfer from studies of tube bank heat exchangers. Experimental verification of the model shows that, with some minor modification to the heat transfer correlations, it reasonably represents heat transfer trends. Flow resistance trends are under-predicted for both inline and staggered pin arrangements. Even with these limitations this tool is useful for the optimization and pin arrangement selection of pin fin heatsinks

Keywords

cooling; heat exchangers; heat sinks; packaging; flow resistance; heat transfer; heat transfer correlations; heat transfer trends; inline arrangements; model; optimization; pin fin heatsinks; staggered pin arrangements; tube bank heat exchangers; Analytical models; Die casting; Electronic packaging thermal management; Electronics cooling; Heat sinks; Heat transfer; Pins; Resistance heating; Space technology; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1089-9870

Print_ISBN

0-7803-5912-7

Type

conf

DOI

10.1109/ITHERM.2000.866809

Filename

866809