• DocumentCode
    355920
  • Title

    Thermal analysis of two protruding heaters mounted on a substrate plate suspended in an enclosure

  • Author

    Martins, Eduardo B. ; Altemani, Carlos A C

  • Author_Institution
    Dept. of Energy, State Univ. of Campinas, Brazil
  • Volume
    1
  • fYear
    2000
  • fDate
    2000
  • Lastpage
    354
  • Abstract
    An experimental and numerical investigation was performed to evaluate the relative contributions of thermal radiation, natural convection and conduction-to-substrate heat losses from protruding components mounted on a PCB in a sealed enclosure. The experimental apparatus consisted of an air filled enclosure of rectangular cross section where a substrate plate with two longitudinal protruding heaters mounted on one side was suspended. For a range of electric power dissipation in each heat source, several enclosure temperatures were measured under steady conditions and a global thermal resistance from each heater to the atmospheric air outside the enclosure was obtained. These results were compared with those from a two-dimensional numerical simulation combining the finite volumes and the radiosities methods, assuming gray surfaces behavior. The blockage effects of the substrate plate with both protruding heaters to thermal radiation inside the enclosure were taken into account in the numerical analysis. The resulting favorable comparison allowed confidence to the numerical evaluation of the desired relative contributions of the distinct heat loss mechanisms. Conduction-to-substrate was the major contribution, and contribution in the present experiments. The numerical radiation and natural convection had about the same simulation of an actual PCB with heat sources in a sealed enclosure should include all conjugate heat loss mechanisms
  • Keywords
    heat losses; printed circuits; thermal analysis; thermal management (packaging); thermal resistance; PCB; conduction-to-substrate heat loss; conjugate heat loss; electric power dissipation; finite volume method; global thermal resistance; gray surface; natural convection; protruding heater; radiosity method; sealed enclosure; suspended substrate plate; thermal analysis; thermal radiation; two-dimensional numerical simulation; Atmospheric measurements; Cogeneration; Electric variables measurement; Electrical resistance measurement; Performance evaluation; Power measurement; Temperature distribution; Temperature measurement; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-5912-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2000.866846
  • Filename
    866846