Delamination and Electromigration of Film Lines on Polymer Substrate Under Electrical Loading

As the main influencing factors for instability of film lines are widely used in microelectromechanical systems, buckle-driven delamination and electromigration of film lines on polymer substrate under electrical loading are reported in this letter. The critical buckling condition is obtained through Euler formula. In addition, postbuckling analysis for the film is derived to calculate the residual stress distribution. Both electromigration and buckling stress control the film fracture. Film buckling depends not only on the thermal mismatch between the film line and the substrate but also on the applied electrical loading.