• DocumentCode
    3561742
  • Title

    CodeAware: Sensor-Based Fine-Grained Monitoring and Management of Software Artifacts

  • Author

    Abreu, Rui ; Erdogmus, Hakan ; Perez, Alexandre

  • Author_Institution
    Palo Alto Res. Center, Palo Alto, CA, USA
  • Volume
    2
  • fYear
    2015
  • Firstpage
    551
  • Lastpage
    554
  • Abstract
    Current continuous integration (CI) tools, although extensible, can be limiting in terms of flexibility. In particular, artifact analysis capabilities available through plug in mechanisms are both coarse-grained and centralized. To address this limitation, this paper introduces a new paradigm, Code Aware, for distributed and fine-grained artifact analysis. Code Aware is an ecosystem inspired by sensor networks, consisting of monitors and actuators, aimed at improving code quality and team productivity. Code ware´s vision entails (a) the ability to probe software artifacts of any granularity and localization, from variables to classes or files to entire systems, (b) the ability to perform both static and dynamic analyses on these artifacts, and (c) the ability to describe targeted remediation actions, for example to notify interested developers, through automated actuators. We provide motivational examples for the use of Code Aware that leverage current CI solutions, sketch the architecture of its underlying ecosystem, and outline research challenges.
  • Keywords
    productivity; program diagnostics; software quality; CI tools; CodeAware; artifact analysis capabilities; automated actuators; code quality improvement; continuous integration tools; distributed artifact analysis; dynamic analysis; ecosystem; fine-grained artifact analysis; monitors; plug in mechanisms; sensor-based fine-grained monitoring; software artifact management; static analysis; team productivity improvement; DSL; Ecosystems; Electronic mail; Monitoring; Probes; Software; Software engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Software Engineering (ICSE), 2015 IEEE/ACM 37th IEEE International Conference on
  • Type

    conf

  • DOI
    10.1109/ICSE.2015.192
  • Filename
    7203010