• DocumentCode
    3565109
  • Title

    Scaling breakthrough for analog/digital circuits by suppressing variability and low-frequency noise for FinFETs by amorphous metal gate technology

  • Author

    Matsukawa, Takashi ; Fukuda, Koichi ; Yongxun Liu ; Tsukada, Junichi ; Yamauchi, Hiromi ; Ishikawa, Yuki ; Endo, Kazuhiko ; O´uchi, Shin-ichi ; Migita, Shinji ; Mizubayashi, Wataru ; Morita, Yukinori ; Ota, Hiroyuki ; Masahara, Meishoku

  • Author_Institution
    Nanoelectron. Res. Inst., Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan
  • fYear
    2014
  • Abstract
    The effectiveness of amorphous metal gate (MG) in suppressing low-frequency noise (LFN) for FinFETs has been thoroughly investigated. It was demonstrated that the amorphous TaSiN MGs with various atomic compositions provide flexible tuning of threshold voltage (Vt) as well as small Vt variability, namely AVt. It was found that the TaSiN-MG FinFETs exhibit drastic reduction of LFN in comparison to the poly-crystalline TiN MG case. Modelling by 3D-TCAD reveals that work function variation (WFV) of the MG has a significant impact on LFN generation. Suppression of AVt and LFN is highly beneficial to conduct further scaling of analog/digital components in SoC.
  • Keywords
    MOSFET; amorphous semiconductors; circuit noise; circuit tuning; mixed analogue-digital integrated circuits; scaling circuits; silicon compounds; system-on-chip; tantalum compounds; technology CAD (electronics); three-dimensional integrated circuits; titanium compounds; 3D-TCAD; FinFET; LFN generation reduction; TaSiN; TiN; WFV; amorphous metal gate technology; analog-digital circuit SoC; atomic compositions; flexible tuning; polycrystalline MG case; scaling breakthrough; threshold voltage; variability low-frequency noise suppression; work function variation; Correlation; Films; FinFETs; Fluctuations; Logic gates; Silicon; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2014 IEEE International
  • Type

    conf

  • DOI
    10.1109/IEDM.2014.7047035
  • Filename
    7047035