DocumentCode
3565194
Title
Wafer level system integration for SiP
Author
Yu, Douglas C. H.
Author_Institution
Taiwan Semicond. Manuf. Co. R&D, Hsinchu, Taiwan
fYear
2014
Abstract
A family of novel wafer-level-system-integration technologies (WLSI) was proposed. This paper reviews WLSI feasibility work first. Further results on the reliability, the compatibility of the integration with both more advanced node Logic and DRAM devices, and the higher-level system integration of the WLSI technologies are then presented. Foundry has established a comprehensive system integration technology portfolio in wafer form to fulfill the needs from mobile to cloud computing for the future growth of the Si-based nano-electronics industry.
Keywords
DRAM chips; cloud computing; elemental semiconductors; mobile computing; nanoelectronics; silicon; system-in-package; wafer level packaging; DRAM devices; SiP; cloud computing; mobile computing; nanoelectronics industry; node logic; wafer level system integration; FinFETs; Integrated circuit reliability; Semiconductor device reliability; Three-dimensional displays; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2014 IEEE International
Type
conf
DOI
10.1109/IEDM.2014.7047117
Filename
7047117
Link To Document