• DocumentCode
    3565699
  • Title

    Agenda of conference

  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The following topics are dealt with: microsystems, packaging and materials; interconnection & 3D integration; thermal management; thermal-mechanical modeling; and advanced packaging & flexible electronics.
  • Keywords
    flexible electronics; integrated circuit interconnections; micromechanical devices; thermal management (packaging); 3D integration; advanced packaging; flexible electronics; interconnection; microsystems; thermal management; thermal-mechanical modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
  • Type

    conf

  • DOI
    10.1109/IMPACT.2014.7048337
  • Filename
    7048337
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3565699