• DocumentCode
    3565727
  • Title

    Organizers and sponsors

  • fYear
    2014
  • Firstpage
    498
  • Lastpage
    498
  • Abstract
    The conference organizers greatly appreciate the support of the various corporate sponsors listed.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
  • Type

    conf

  • DOI
    10.1109/IMPACT.2014.7048344
  • Filename
    7048344
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3565727