300MM wiring enabling 28Gbps transmission on LCP board (PALAP)

Author

Kataoka, Ryohei ; Kondo, Koji ; Akimichi, Jun ; Akiyama, Yutaka ; Hashimoto, Kaoru ; Otsuka, Kanji

Author_Institution

Denso Corp., Kariya, Japan

fYear

2014

Firstpage

309

Lastpage

312

Abstract

Recent cloud computing communication strongly requires an order of magnitude higher bandwidth. For example, the maximum rate prescribed for SerDes and Interlaken is 28Gbps. This trend can be observed in new enterprise servers or enterprise routers. Boards and cards for enterprise devices are often relatively large, e.g., 300mm × 500mm, with more than 60 layers. Fine pitch wiring of over 300mm length is therefore needed in each layer. We have developed an LCP board with 28Gbps bandwidth along with a 300mm wiring length, 100um width and 380um pitch, to be described in detail. The board can be produced using DENSO´s PALAP process, which is useful for high-density solutions involving more than 100 layers.

Keywords

fine-pitch technology; liquid crystal polymers; printed circuits; wiring; DENSO PALAP process; LCP board; bit rate 28 Gbit/s; enterprise routers; enterprise servers; fine pitch wiring; liquid crystal polymer board; size 100 mum; size 300 mm; size 380 mum; Bandwidth; Copper; Dielectrics; Materials; Rough surfaces; Surface roughness; Wiring; I/O interface wiring; high speed PC board; ultra high speed wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International

Type

conf

DOI

10.1109/IMPACT.2014.7048357

Filename

7048357