• DocumentCode
    3565766
  • Title

    LED flip chip packaging trends with tear down study

  • Author

    Onishi, T.

  • Author_Institution
    Grand Joint Technol. Ltd., Hong Kong, China
  • fYear
    2014
  • Firstpage
    198
  • Lastpage
    199
  • Abstract
    LED Solid state lighting is becoming increasingly important in the future & high performance is required more. Checking LED device actual inside, to confirm packaging structure and key LED packaging technology current status of Europe, US and Asian LED flip chip packaging. Also describe the current status of research and development situation on LED flip-chip and wafer-level LED packaging. This paper show LED flip chip packaging technology trends. - Study of LED high power flip chip type packaging technology with x-rays analysis - Key LED packaging technology trends.
  • Keywords
    flip-chip devices; light emitting diodes; research and development; wafer level packaging; LED flip chip packaging; LED solid state lighting; research and development; tear down study; wafer-level LED packaging; Aluminum oxide; Ceramics; Flip-chip devices; Light emitting diodes; Market research; Packaging; Substrates; LED flip chip device; LED lighting; X-rays analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
  • Type

    conf

  • DOI
    10.1109/IMPACT.2014.7048358
  • Filename
    7048358