DocumentCode
3565774
Title
The novel solvent-soluble polyimide characterized by low Dk, low Df, and high heat resistance
Author
Tasaki, Takashi
Author_Institution
HB Group R&D Dept., Arakawa Chem. Ind., Ltd., Osaka, Japan
fYear
2014
Firstpage
259
Lastpage
262
Abstract
Enlargement of transmitting data and speeding up of transmission frequency in circuits is rapidly progressing as advances of communication and information technology. Consequently, for print circuit boards corresponded to high frequency transmission, circuit design and material option is increasingly important.
Keywords
permittivity; printed circuit design; circuit design; communication and information technology; data transmission; dielectric constant; dielectric tangent; high frequency transmission; high heat resistance; low Df heat resistance; low Dk heat resistance; material option; printed circuit boards; solvent-soluble polyimide characterization; speeding transmission; Dielectrics; Films; Polyimides; Resistance heating; Solvents;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type
conf
DOI
10.1109/IMPACT.2014.7048361
Filename
7048361
Link To Document