DocumentCode
3565783
Title
Study on fatigue reliability evaluation for lead free solder joints
Author
Mizukami, Daisuke ; Matsuo, Ryuta ; Qiang Yu
Author_Institution
Yokohama Nat. Univ., Yokohama, Japan
fYear
2014
Firstpage
117
Lastpage
120
Abstract
In this study, the aim is to establish the efficient method of life evaluation with checking it´s consistent with real test. Firstly, as to the effect of hardening rule, differences between analysis result of isotropic and that of kinematic are small and analysis time of kinematic is longer than that of isotropic. Isotropic hardening is more effective, and its utility is higher than that of kinematic. Secondly, as to the effect of element size, the differences of analysis results between element size of soldier joints=6.25[μm] and 12.5[μm] is almost none, and analysis time of 12.5[μm] is shorter, so using 12.5[μm] is more efficient. Thirdly, as to the effect of the number of deleting elements of every fatigue crack analysis, it should be decided in just proportion not to grow cracks by taking wrong route.
Keywords
fatigue cracks; hardening; reliability; solders; element size effect; fatigue crack analysis; fatigue reliability evaluation; hardening rule effect; isotropic hardening; kinematic analysis time; lead free solder joints; life evaluation method; size 12.5 mum; size 6.25 mum; Accuracy; Fatigue; Kinematics; Shearing; Soldering; Strain; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type
conf
DOI
10.1109/IMPACT.2014.7048364
Filename
7048364
Link To Document