DocumentCode
3565786
Title
Cu plating on film substrate by UV surface reformation treatment technology
Author
Onitake, Shigeo ; Harada, Susumu
Author_Institution
Koto Electr. Co., Ltd., Tokyo, Japan
fYear
2014
Firstpage
271
Lastpage
273
Abstract
LCP (Liquid crystal polymer) is suitable for next flexible substrate generation for high speed transmission, and COP (Cyclo Olefin Polymer) has good material performance for RF products & medical healthcare application with very lower moisture absorption, lower ion contamination, good gas barrier, good transparence and lower protein adsorption with no fluorescing. But usually those LCP & COP materials are not suitable for Cu plating with previously conventional technologies. UV surface treatment technology can apply to Cu plating onto PI, LCP &COP flexible film substrate for keeping good adhesion force with nano-anchor approaching.
Keywords
copper; electroplating; liquid crystal polymers; substrates; surface treatment; Cu; UV surface reformation treatment technology; cyclo olefin polymer; film substrate; flexible substrate generation; high speed transmission; liquid crystal polymer; plating; Films; Glass; Radiation effects; Substrates; Surface treatment; Surface waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type
conf
DOI
10.1109/IMPACT.2014.7048367
Filename
7048367
Link To Document