Advanced non-etching adhesion promoter for next generation IC packaging

In this paper findings from the development of a new Non Etching Adhesion Promoter process (NEAP) targeting inner and outer layer bonding are discussed. The herein described approach propagates a nano-scale copper structure that forms a thin anchoring layer with increased surface area, but hardly contributes to the surface roughness. The superb adhesion results obtained to a wide range of dielectrics support the hypothesis of a mechanical type of adhesion mechanism. This paper also outlines detailed examinations on impacts of the adhesion promoter to subsequent processes revealing an unaffected performance generating conductors with excellent geometries for inner- and outerlayer application and clear benefits to the industry.