Mechanical property analyses on power diodes in a typical 5W adapter

Author

Zhong-Yi Wu ; Pei-Hsuan Wu ; Hu, Annie ; Kao, Jeff ; Lee, Robert ; Chen, Richard ; Chung, Harrison ; Ben-Je Lwo

Author_Institution

Dept. of Mechatron., Energy & Aerosp. Eng., Nat. Defense Univ., Taichung, Taiwan

fYear

2014

Firstpage

454

Lastpage

457

Abstract

In this paper, we perform thermal and thermo-stress analyses on diode packaging with both currently used (traditional) and the newly designed (Zowie) structures in a 5W power adapter. To this end, a global-local methodology with ANSYS FEM software were employed with the equivalent material property equations, and temperature distribution measurements were simultaneously carried out for verification and extracting boundary conditions. The simulated mechanical behaviors on the two packaging designs are finally compared with discussions in this study.

Keywords

finite element analysis; power semiconductor diodes; semiconductor device packaging; temperature distribution; thermal management (packaging); thermal stresses; ANSYS FEM software; boundary conditions; diode packaging; equivalent material property equations; global-local methodology; mechanical property analyses; power 5 W; power adapter; power diodes; temperature distribution measurements; thermal stress analyses; thermo-stress analyses; Adaptation models; Bridges; Finite element analysis; Packaging; Schottky diodes; Stress; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International

Type

conf

DOI

10.1109/IMPACT.2014.7048393

Filename

7048393