DocumentCode
3566714
Title
Efficacy of statistical model-based pose estimation of rigid objects with corresponding CAD models using commodity depth sensors
Author
Landau, Michael J. ; Beling, Peter A. ; DeVore, Michael D.
Author_Institution
Dept. of Syst. & Inf. Eng., Univ. of Virginia, Charlottesville, VA, USA
fYear
2014
Firstpage
3445
Lastpage
3451
Abstract
Since the emergence of the commodity-priced, small-sized Microsoft Kinect™ sensor, 3D object pose estimation has become prevalent in many applications across a wide variety of disciplines. However, because most current methods require a hard assignment between a measurement point cloud and a given CAD model point cloud for alignment, accurate pose estimation is limited to a small range of sensor noise and resolution, and CAD model precision. This paper therefore presents a MLE algorithm that achieves a statistically optimal global maximum likelihood on the surface of the continuous 6D pose domain by soft assigning all measurement points to all model points. The accuracy in estimation of orientation and position of the MLE algorithm is then compared to a variant of the ICP method that accounts for an anisotropie Gaussian measurement noise distribution. It is finally shown through a series of simulated measurement point clouds and depth images that MLE outperforms the ICP variant, and achieves a monotonie increase in performance with an increase in either points on target or CAD model precision.
Keywords
CAD; image sensors; maximum likelihood estimation; pose estimation; CAD model; MLE algorithm; Microsoft Kinect sensor; commodity depth sensor; maximum likelihood estimation; point cloud; sensor noise; statistical model-based pose estimation; Design automation; Maximum likelihood estimation; Noise; Sensors; Solid modeling; Three-dimensional displays; Iterative Closest Point (ICP); Maximum Likelihood Estimation (MLE); Microsoft Kinect™; computer-aided design (CAD); image analysis; pose estimation;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics Society, IECON 2014 - 40th Annual Conference of the IEEE
Type
conf
DOI
10.1109/IECON.2014.7049009
Filename
7049009
Link To Document