• DocumentCode
    3567755
  • Title

    Design and simulation of on-chip circuits for parallel characterization of ultrascaled transistors for BTI reliability

  • Author

    Putcha, Vamsi ; Bury, Erik ; Weckx, Pieter ; Franco, Jacopo ; Kaczer, Ben ; Groeseneken, Guido

  • Author_Institution
    KU Leuven, Leuven, Belgium
  • fYear
    2014
  • Firstpage
    99
  • Lastpage
    102
  • Abstract
    A novel on-chip test circuit architecture to perform BTI characterization of single devices using the Measure-Stress-Measure (MSM) method is designed and simulations were performed to confirm that the design is fully functional. Characterization throughput was maximized using pipelining. A `place-and-check´ algorithm was developed to generate optimized pipelining of individual device measurements. The novel pipelining methodology was corroborated with real measurements, in accordance with the generated pipelining sequence and proposed circuit architecture. The results are shown to be consistent with the data obtained from conventional measurement methods and an improvement of 82% was achieved in total BTI characterization time of 4096 devices.
  • Keywords
    MOSFET; integrated circuit reliability; integrated circuit testing; BTI reliability; MSM method; bias temperature instability; characterization throughput; device measurement; measure-stress-measure method; on-chip test circuit; pMOS FinFET; parallel characterization; pipelining sequence; place-and-check algorithm; ultrascaled transistor; Arrays; Logic gates; Pipeline processing; Stress; Timing; Transistors; ‘place-and-check’; BTI; characterization; circuit architecture; circuit design; eMSM; pipelining; timing strategy; ultrafast; variability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International
  • Print_ISBN
    978-1-4799-7308-8
  • Type

    conf

  • DOI
    10.1109/IIRW.2014.7049520
  • Filename
    7049520