DocumentCode
3567755
Title
Design and simulation of on-chip circuits for parallel characterization of ultrascaled transistors for BTI reliability
Author
Putcha, Vamsi ; Bury, Erik ; Weckx, Pieter ; Franco, Jacopo ; Kaczer, Ben ; Groeseneken, Guido
Author_Institution
KU Leuven, Leuven, Belgium
fYear
2014
Firstpage
99
Lastpage
102
Abstract
A novel on-chip test circuit architecture to perform BTI characterization of single devices using the Measure-Stress-Measure (MSM) method is designed and simulations were performed to confirm that the design is fully functional. Characterization throughput was maximized using pipelining. A `place-and-check´ algorithm was developed to generate optimized pipelining of individual device measurements. The novel pipelining methodology was corroborated with real measurements, in accordance with the generated pipelining sequence and proposed circuit architecture. The results are shown to be consistent with the data obtained from conventional measurement methods and an improvement of 82% was achieved in total BTI characterization time of 4096 devices.
Keywords
MOSFET; integrated circuit reliability; integrated circuit testing; BTI reliability; MSM method; bias temperature instability; characterization throughput; device measurement; measure-stress-measure method; on-chip test circuit; pMOS FinFET; parallel characterization; pipelining sequence; place-and-check algorithm; ultrascaled transistor; Arrays; Logic gates; Pipeline processing; Stress; Timing; Transistors; ‘place-and-check’; BTI; characterization; circuit architecture; circuit design; eMSM; pipelining; timing strategy; ultrafast; variability;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International
Print_ISBN
978-1-4799-7308-8
Type
conf
DOI
10.1109/IIRW.2014.7049520
Filename
7049520
Link To Document