DocumentCode
3568101
Title
Numerical analysis of an array of ball grid components
Author
Cole, Reena ; Davies, Mark
Author_Institution
Stokes Res. Inst., Limerick Univ., Ireland
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
61
Lastpage
68
Abstract
Numerical modeling is a valuable analysis tool, however it is still a time consuming process and it is imperative that models be validated. The authors have proposed an alternative to full-scale numerical modeling as a first level design tool, which involves the use aerodynamic and thermal influence factors. Cole et al. [2001] presented a ball grid array (BGA) test apparatus, and also presented aerodynamic measurements made using particle image velocimetry (PIV). Part II of that paper presented thermal resistance measurements, influence factors calculated, and infrared images of surface temperatures. This paper presents numerical models made with an industry standard computational fluid dynamics (CFD) package, using the benchmark data provided from the previous work. The objective is to validate the numerical models, in order to be able to examine additional geometries.
Keywords
aerodynamics; ball grid arrays; computational fluid dynamics; integrated circuit packaging; thermal conductivity; thermal resistance; aerodynamic factors; ball grid component array; benchmark data; computational fluid dynamics; first level design tool; full-scale numerical modeling; numerical models; particle image velocimetry; thermal conductivity; thermal influence factors; thermal resistance; Aerodynamics; Computational fluid dynamics; Electrical resistance measurement; Electronics packaging; Numerical analysis; Numerical models; Particle measurements; Testing; Thermal factors; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012439
Filename
1012439
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