• DocumentCode
    3568269
  • Title

    Coupled circuit-electromagnetic simulation with time domain integral equations

  • Author

    Chuanyi Yang ; Jandhyala, V.

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
  • Volume
    3
  • fYear
    2003
  • Firstpage
    316
  • Abstract
    Time domain electromagnetic solvers are useful for simulating coupled circuit-electromagnetic (EM) problems involving integrated circuit packages and systems-on-chip, wherein effects of nonlinearities of circuit elements can be modeled accurately. The surface-based time domain integral equation (TDIE) approach has been gaining in popularity owing to its flexibility in modeling arbitrarily-shaped structures and its enhanced computational performance due to advances in fast solution methods. In this work, a generalized rigorous coupling scheme, to simultaneously simulate circuits with SPICE-like time-domain simulation, and EM interactions with a TDIE method, is presented. This approach enables direct solution of circuit-EM equations without the need for generating port models. The method permits both circuit and EM excitations and thereby has potential as a signal integrity and as an EMI/EMC modeling tool.
  • Keywords
    circuit simulation; computational electromagnetics; coupled circuits; electromagnetic compatibility; electromagnetic interference; integral equations; EM excitations; EM interactions; EMC; EMI; SPICE-like time-domain simulation; TDIE; arbitrarily-shaped structures; coupled circuit-electromagnetic simulation; signal integrity modeling; surface-based time domain integral equations; time domain electromagnetic solvers; Circuit simulation; Computational modeling; Coupling circuits; Electromagnetic coupling; Electromagnetic interference; Electromagnetic modeling; Integral equations; Integrated circuit modeling; Integrated circuit packaging; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2003. IEEE
  • Print_ISBN
    0-7803-7846-6
  • Type

    conf

  • DOI
    10.1109/APS.2003.1219851
  • Filename
    1219851