DocumentCode
3573143
Title
In-Situ Doped P+ Polysilicon as a MOS Gate Material
Author
Dantu, S.V. ; Tarr, N.G. ; Peters, C.J.
Author_Institution
Department of Electronics, Carleton University, Ottawa, Ontario, Canada K1S 5B6
fYear
1994
Firstpage
373
Lastpage
376
Abstract
The effect of rapid thermal anneal cycles typical of those required for source/drain implant activation on flatband voltage, interface state density, and dielectric strength in MOS capacitors with heavily in-situ boron doped polysilicon gates over thin thermal oxide is studied. Anneal cycles of up to 1050°C, 10 s should be acceptable for use of in-situ doped p+ gates in a CMOS process.
Keywords
Boron; CMOS technology; Capacitance-voltage characteristics; Channel bank filters; Doping; Implants; MOS capacitors; MOSFETs; Rapid thermal annealing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1994. ESSDERC '94. 24th European
Print_ISBN
863321579
Type
conf
Filename
5435739
Link To Document