DocumentCode
3574921
Title
Table of contents
fYear
2014
Abstract
The following topics are dealt with: electromagnetic phenomena; reliability characterization; sensors; actuators; microfluidics; MEMS packaging; and MEMS fabrication.
Keywords
actuators; microfabrication; microfluidics; packaging; sensors; MEMS fabrication; MEMS packaging; actuator; electromagnetic phenomena; microelectromechanical system; microfluidic; reliability characterization; sensor; Fabrication; Micromechanical devices; Nanoscale devices; Publishing; Thermal force; Thermal sensors; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
Print_ISBN
978-2-35500-028-7
Type
conf
DOI
10.1109/DTIP.2014.7056627
Filename
7056627
Link To Document