• DocumentCode
    3574986
  • Title

    Remote power feed and control of MEMS with 58 V silicon photovoltaic cell made by a CMOS post-process dry release and device isolation method

  • Author

    Mori, Isao ; Kubota, Masanori ; Lebrasseur, Eric ; Mita, Yoshio

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Tokyo, Tokyo, Japan
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A small autonomous device integrating MEMS, CMOS and photovoltaic (PV) cells has many attractive applications. For such a device, using light as a power source is preferable because power feeding and control signal transmitting can be done at the same time and in a remote manner. We demonstrated the remote power feeding to a MEMS actuator by light using PV cell array. In this article, we first proposed a new dry release method of MEMS structure for a CMOS-MEMS-PV integration. The method does not require vapor HF and thus we can avoid damage to CMOS circuits. We demonstrated the method by releasing MEMS cantilevers. Next, we prepared a PV cell array integrable with CMOS and MEMS. Its open circuit voltage was 58 V and its maximum power was 43.3 μW. We conducted an experiment to drive a MEMS comb drive actuator remotely, irradiating laser light from the distance of 1.5 m. The PV cell array successfully fed power and the actuator moved 1.0 μm, two-thirds of the calculated value.
  • Keywords
    CMOS integrated circuits; cantilevers; microactuators; photovoltaic cells; silicon; CMOS circuits; CMOS post-process; CMOS-MEMS-PV integration; MEMS actuator; MEMS cantilevers; MEMS structure; PV cell array; Si; device isolation method; dry release method; laser light irradiation; open circuit voltage; remote power feeding; silicon photovoltaic cell; size 1 mum; size 1.5 m; voltage 58 V; Actuators; Arrays; CMOS integrated circuits; Drives; Etching; Micromechanical devices; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
  • Print_ISBN
    978-2-35500-028-7
  • Type

    conf

  • DOI
    10.1109/DTIP.2014.7056670
  • Filename
    7056670