DocumentCode
3574995
Title
Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress
Author
Lucibello, A. ; Capoccia, G. ; Proietti, E. ; Marcelli, R. ; Margesin, B. ; Mulloni, V. ; Giacomozzi, F. ; Vitulli, F. ; Scipioni, M. ; Bartolucci, G.
Author_Institution
Inst. for Microelectron. & Microsyst., IMM Roma, Rome, Italy
fYear
2014
Firstpage
1
Lastpage
5
Abstract
Space components need a ground characterization based on several solicitations, including mechanical and thermal stress, before their final qualification. In this paper, RF MEMS switches designed for redundancy logic have been extensively measured with promising results in terms of thermal and mechanical cycles. Packaging contributions have been also discussed.
Keywords
ceramic packaging; microswitches; redundancy; thermal stresses; RF MEMS LTCC packaged switch; ground characterization; low temperature cofired ceramic packaging; mechanical stress; radiofrequency microelectromechanical system switch; redundancy logic; space component; thermal stress; Insertion loss; Micromechanical devices; Packaging; Performance evaluation; Radio frequency; Redundancy; RF MEMS; redundancy; reliability; space components;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
Print_ISBN
978-2-35500-028-7
Type
conf
DOI
10.1109/DTIP.2014.7056679
Filename
7056679
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