• DocumentCode
    3574996
  • Title

    Creep in MEMS

  • Author

    Soma, A. ; De Pasquale, G. ; Saleem, M.M.

  • Author_Institution
    Dept. of Mech. & Aerosp. Eng., Politec. di Torino, Turin, Italy
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The study of creep in MEMS is crucial for their lifetime prediction and reliability evaluation. The experimental approaches used in macromechanics can be extended to the microscale if their effectiveness is proved by dedicated experiments. This goal may provide more general validity of creep effects prediction in MEMS, instead of spotted experiments on single devices like those ones reported in most of the work presented in literature. The demonstration of the validity of some established creep models and experimental methodologies also in the micromechanics is the goal of this paper.
  • Keywords
    creep; micromechanical devices; semiconductor device reliability; MEMS; creep effects prediction; lifetime prediction; macromechanics; micromechanics; reliability evaluation; Creep; Fatigue; Micromechanical devices; Reliability; Strain; Stress; Temperature measurement; creep; lifetime; permanent strain; plastic strain; reliability; temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
  • Print_ISBN
    978-2-35500-028-7
  • Type

    conf

  • DOI
    10.1109/DTIP.2014.7056680
  • Filename
    7056680