• DocumentCode
    3578187
  • Title

    Electronic and electrothermal switching dynamics in chalcogenide-based phase-change memory (PCM)

  • Author

    Yiqun Wei ; Peng Gong ; Xinnan Lin

  • Author_Institution
    Key Lab. of Integrated Microsyst., Peking Univ., Shenzhen, China
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Towards reliability optimization of chalcogenide-based phase-change memory cells, the study on transport and phase-transition models are necessary. A threshold switch model based on the hopping transport mechanism and the field-assisted trap-to-band excitation mechanism is presented, accounting for the scaling dependence of the threshold voltage and current. The read reliability issues related to the structure relaxation effect are discussed using this model. A phase switch algorithm based on the nucleation-growth theory and Monte-Carlo method is achieved, which is able to model the random nuclei generation and growth progress including interface effect. Through the simulations of nucleation dominant material and growth dominant material, the prospect of nucleation-growth phenomenon is shown. The data retention capability is evaluated by the model.
  • Keywords
    Monte Carlo methods; circuit reliability; phase change memories; relaxation theory; Monte-Carlo method; PCM; chalcogenide-based phase-change memory cell; data retention capability; electronic switching dynamics; electrothermal switching dynamics; field-assisted trap-to-band excitation mechanism; growth dominant material; hopping transport mechanism; nucleation dominant material; nucleation-growth phenomenon; nucleation-growth theory; phase switch algorithm; phase-transition model; random nuclei generation model; reliability optimization; structure relaxation effect; threshold switch model; Reliability; Switches; Phase-change Memory; electronic; electrothermal; switching dynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits (EDSSC), 2014 IEEE International Conference on
  • Type

    conf

  • DOI
    10.1109/EDSSC.2014.7061263
  • Filename
    7061263