Intensive cooling method for power electronic component with high heat flux

A significant amount of attention has been focused on the methods of high heat flux removal due to the advancing requirements of the electronics industry. Water spray cooling is one of the best candidates for these thermal control problems. A new heater designed to simulate the high heat flux was briefly presented. The heating part of the heater was Insulated-Gate-Bipolar-Transistor (IGBT) component working at high speed switching state, which could generate a considerable amount of heat. In order to keep the junction temperature of the IGBT component within an acceptable limit, the component was cooling by the water spray cooling system. Subsequently, the conventional PID (proportional-integral-derivative) and self-tuning fuzzy PID algorithm were applied to indirectly control the junction temperature of the IGBT component to achieve the reference temperature. The results show the self-tuning fuzzy PID algorithm is much better than the conventional PID algorithm for this thermal management application. The tests are of great significance to the further study of water spray cooling and the high-power electrical devices working under extremely unfavorable conditions.