• DocumentCode
    358132
  • Title

    The dielectric and mechanical properties of PA-6/PP blends

  • Author

    Yu, Demei ; Wu, Songzhen ; Xie, Darong

  • Author_Institution
    Xi´´an Jiaotong Univ., China
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    1062
  • Abstract
    A series of PA-6/PP polymer blends for electric-insulation were prepared using a Haake-90 twin-screw extruder with different blending ratio and amount of compatibilizer. The dielectric and mechanical properties of both dry and water-treated specimens were tested. It was found that the change of the dielectric properties of the blends with the blending ratio and the content of compatibilizer was of the same tendency as the mechanical properties under dry condition, but was not under wet condition. The stability in dielectric properties of the blends under wet condition was more dependent on the composition and compatibility than that in mechanical properties, and can be effectively improved by the proper selection of the blending ratio and the content of compatibilizer. The morphology of the blends was also observed to reveal the relationship between the dielectric and mechanical properties and microstructures of the blends
  • Keywords
    dielectric properties; materials preparation; mechanical properties; organic insulating materials; polymer blends; polymer structure; polymerisation; Haake-90 twin-screw extruder; PA-6/PP blends; blending ratio; compatibilizer; dielectric properties; dry-treated specimens; electric-insulation; mechanical properties; microstructures; morphology; stability; water-treated specimens; Dielectric breakdown; Dielectric losses; Dielectric materials; Dielectrics and electrical insulation; Mechanical factors; Microstructure; Plastics industry; Polymers; Stability; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2000. Proceedings of the 6th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    0-7803-5459-1
  • Type

    conf

  • DOI
    10.1109/ICPADM.2000.876416
  • Filename
    876416