Extending the fatigue life of SGA interconnects for aerospace applications

Author

Larson, Michael C. ; Verges, Melody A.

Author_Institution

Dept. of Mech. Eng., Tulane Univ., New Orleans, LA, USA

Volume

5

fYear

2000

fDate

2000

Firstpage

319

Abstract

The effect of residual stresses on the fatigue life of a solder grid array (SGA) interconnect is modeled using fracture mechanics. A fatigue crack growth model is proposed for an interconnect subject to cyclic shear loading in conjunction with either a constant crack-opening or a constant crack-closing stress. The residual stresses stem from the constant mean curvature shape of the interconnect and depend upon the volume of solder and the distance between the printed circuit board and chip carrier. Experiments are reported which support the residual force approximations. The fracture model can be used to predict how the relative fatigue life of a solder interconnect can be extended

Keywords

avionics; ball grid arrays; fatigue cracks; fracture mechanics; interconnections; internal stresses; reflow soldering; PCB to chip carrier distance; aerospace applications; constant crack-closing stress; constant crack-opening stress; constant mean curvature shape; cyclic shear loading; fatigue crack growth model; fatigue life; forces on liquid bridge; fracture mechanics modelling; residual force approximations; residual stresses effect; solder grid array interconnects; Aerospace engineering; Delay effects; Fatigue; Geometry; Integrated circuit interconnections; Mechanical engineering; Packaging; Printed circuits; Residual stresses; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace Conference Proceedings, 2000 IEEE

Conference_Location

Big Sky, MT

ISSN

1095-323X

Print_ISBN

0-7803-5846-5

Type

conf

DOI

10.1109/AERO.2000.878504

Filename

878504