• DocumentCode
    3594080
  • Title

    An overview of light decay failure modes in lead-frame LED packages

  • Author

    Youxing Yuan ; He Wang ; Jay Guoxu Liu

  • Author_Institution
    Shineon (Beijing) Technol. Co., Ltd., Beijing, China
  • fYear
    2014
  • Firstpage
    165
  • Lastpage
    169
  • Abstract
    One of the most commonly used LED packages on market is the mid-power LED in a lead-frame package, because of its low cost and high lumen efficiency. However, as the lead-frame package consists silver plated copper and white plastic housing, both for increased light reflection; it can gradually become yellowing or darkening when reacting with certain organic gases or chemical compounds when accelerated by high temperature and light radiation. As a result, light decay or lumen reduction can occur in LED lightings. This paper presents an overview on light decay failure modes of commonly used lead-frame LED package. Four types of failure root cause will be discussed: 1) sulfur induced silver darkening; 2) Halogen (Br, Cl) induced silver and silicone encapsulation yellowing; 3) incompatible volatile organic compounds (VOCs) resulted darkening on or around of LED chips; 4) plastic housing material yellowing.
  • Keywords
    electronics packaging; light emitting diodes; silicones; silver; LED chips; VOC; failure root cause; halogen induced silicone encapsulation yellowing; halogen induced silver encapsulation yellowing; incompatible volatile organic compounds; lead-frame LED packages; light decay failure modes; plastic housing material yellowing; sulfur induced silver darkening; Chemicals; Lead; Light emitting diodes; Plastics; Reliability; Silver;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Lighting (SSLCHINA), 2014 11th China International Forum on
  • Print_ISBN
    978-1-4799-6696-7
  • Type

    conf

  • DOI
    10.1109/SSLCHINA.2014.7127247
  • Filename
    7127247