Patterns for concave corner compensation between vertical (010)-(001) planes on Si(100) anisotropically etched in TMAH

Author

Nikpour, B. ; Landsberger, L.M. ; Hubbard, T.J. ; Kahrizi, M. ; Iftimie, A.

Author_Institution

Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada

Volume

1

fYear

1997

Firstpage

691

Abstract

This work presents a concave corner compensation technique, to substantially reduce the residual (111) flanges between two vertical (010)-(001) planes, underetched on a (100) silicon wafer. A carefully-planned set of rectangles is used, oriented parallel or perpendicular to the wafer flat, at 45° to the desired underetched vertical (010) and (001) planes. The set of rectangles are designed based on several principles, and the behavior during etching is graphically and numerically simulated. The predicted behavior is confirmed by experiment. The technique is used to fabricate a square-cross-section beam for an angular rate measurement sensor. Natural frequencies in horizontal and vertical directions are simulated and compared to measurement

Keywords

angular velocity measurement; compensation; elemental semiconductors; etching; micromachining; micromechanical resonators; microsensors; semiconductor process modelling; silicon; (100) Si wafer; Si; Si(100); TMAH; angular rate measurement sensor; anisotropic etching; concave corner compensation; graphical simulation; horizontal directions; natural frequencies; numerical simulation; rectangle set; residual (111) flanges; square-cross-section beam; vertical (010)-(001) planes; vertical directions; Anisotropic magnetoresistance; Clamps; Fabrication; Flanges; Frequency measurement; Geometry; Numerical simulation; Silicon; Solid modeling; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on

Print_ISBN

0-7803-3829-4

Type

conf

DOI

10.1109/SENSOR.1997.613746

Filename

613746