DocumentCode
3599128
Title
Bond-wires: Readily available integrated millimeter-wave antennas
Author
Johannsen, U. ; Smolders, A.B. ; Leiss, J. ; Gollor, U.
Author_Institution
Dept. of Electr. Eng., Eindhoven Univ. of Technol., Eindhoven, Netherlands
fYear
2012
Firstpage
197
Lastpage
200
Abstract
Wire-bond technology is cost-effective and widely available. This paper presents a mm-wave front-end module concept that exploits this technology for antenna implementation. A straightforward and computationally efficient modeling approach for the design of such antennas is presented that can be used in combination with standard IC design tools. The model was successfully verified with a commercial FDTD solver as well as measurements.
Keywords
finite difference time-domain analysis; lead bonding; millimetre wave antennas; FDTD solver; integrated millimeter-wave antennas; mm-wave front-end module; standard IC design tools; wire-bond technology; Antenna measurements; Antennas; Coplanar waveguides; Integrated circuit modeling; Standards; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference (EuMC), 2012 42nd European
Print_ISBN
978-1-4673-2215-7
Electronic_ISBN
978-2-87487-026-2
Type
conf
Filename
6459211
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