• DocumentCode
    3607246
  • Title

    Compact Physical Model for Crosstalk in Spin-Wave Interconnects

  • Author

    Dutta, Sourav ; Nikonov, Dmitri E. ; Manipatruni, Sasikanth ; Young, Ian A. ; Naeemi, Azad

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    62
  • Issue
    11
  • fYear
    2015
  • Firstpage
    3863
  • Lastpage
    3869
  • Abstract
    We propose a formalism of a compact physical model for crosstalk noise analysis between two coplanar backward volume spin-wave interconnects. Comparing the amplitudes of the signal in the active line and the noise in the victim line, we introduce a figure of merit for crosstalk - the longitudinal or line-to-line coupling. It is shown that the crosstalk becomes prohibitively high as the edge-to-edge spacing between the lines goes down, and thus putting a limitation on the routing and placement in a spin-wave bus network. The position of the peak crosstalk noise coupling for different spacings and frequencies of excitation reveals a new limitation to the maximum interconnect length. Furthermore, the technique of superposition analogous to RLC interconnects is exploited to explain the complicated nature of crosstalk noise and develop a mechanism for modeling crosstalk. Finally, a compact physical model is derived using analytical expressions, which demonstrate a reasonably good agreement with the actual full micromagnetic simulation results.
  • Keywords
    RLC circuits; crosstalk; integrated circuit interconnections; integrated circuit noise; spin waves; RLC interconnect; compact physical model; coplanar backward volume spin-wave interconnect; crosstalk noise analysis; edge-to-edge spacing; line-to-line coupling; spin-wave bus network; superposition technique; Couplings; Crosstalk; Demagnetization; Integrated circuit interconnections; Magnetization; Noise; Tensile stress; Crosstalk; interconnects; micromagnetics; modeling; modeling.;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2015.2478842
  • Filename
    7283585