• DocumentCode
    3618395
  • Title

    Electromigrationreliability of Cu interconnects and impact of low K dielectrics

  • Author

    P.S. Ho;M. Gall

  • fYear
    2004
  • fDate
    6/26/1905 12:00:00 AM
  • Firstpage
    197
  • Lastpage
    197
  • Keywords
    "Dielectrics","Microelectronics","Artificial intelligence","Statistics","Threshold current","Thermomechanical processes"
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2004 IEEE International
  • Print_ISBN
    0-7803-8517-9
  • Type

    conf

  • DOI
    10.1109/IRWS.2004.1422781
  • Filename
    1422781
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3618395