Properties and utilization of 3D bent-multilayer hybrid structures

The specific properties and advantages of the LTCC can be profitably included into the MCM (multi chip module) production technology, sensorial and three-dimensional application using multilayer structures. This paper deals with special treatment of LTCC, which is aimed at construction of 3D bent-multilayer hybrid structures for sensorial applications. The paper refers to general trends and gives an overview of hybrid technology progress and results of reached experiments: experimental analysis of 3D bent multilayer structures and their production technology, inside conductive inspection at bending vertex location represented by the non-destructive measurement of the transitional resistance between two conductive layers, measurement principle of the values of interconnection resistance and principle of the law value interconnection resistance based on computer aided semiautomatic measurements. The 3D bent-multilayer hybrid structures find utilization in sensorial application.