• DocumentCode
    3619242
  • Title

    Chip-package co-design of RF mixed signal microsystems

  • Author

    P.R. Mukund;J. Moon

  • Volume
    1
  • fYear
    2003
  • fDate
    6/25/1905 12:00:00 AM
  • Firstpage
    211
  • Lastpage
    258
  • Keywords
    "Radio frequency","RF signals","Packaging","Signal design","Electrostatic discharge","Circuits and systems","Driver circuits","System-on-a-chip","Power system protection","Power distribution"
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2003. Tutorial Guide: ISCAS 2003. The IEEE International Symposium on
  • Print_ISBN
    0-7803-7991-8
  • Type

    conf

  • DOI
    10.1109/TUTCAS.2003.1490898
  • Filename
    1490898
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3619242