• DocumentCode
    3623778
  • Title

    Organic Chip Packaging Technology For High Speed Processor Applications

  • Author

    Bernd Garben;Andreas Huber;Dierk Kaller;Erich Klink

  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    119
  • Lastpage
    122
  • Keywords
    "Packaging","Wiring","Signal generators","Signal processing","Impedance","Electric variables","Dielectric materials","Dielectric losses","Paper technology","Wire"
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
  • Print_ISBN
    0-7803-9821-1
  • Type

    conf

  • DOI
    10.1109/SPI.2002.258316
  • Filename
    4027674
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3623778