• DocumentCode
    3623791
  • Title

    Investigation of Metal-Organic Chemical Vapor Deposited Copper Diffusion in Tantalum after Annealing

  • Author

    S. Loh;D. Zhang;R. Liu;C. Li;A. S. Wee

  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    173
  • Lastpage
    176
  • Keywords
    "Copper","Annealing","MOCVD","Atomic force microscopy","Conducting materials","Plasma temperature","Scanning electron microscopy","Argon","Chemical technology","Chemical vapor deposition"
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings
  • Print_ISBN
    0-7803-9821-1
  • Type

    conf

  • DOI
    10.1109/SPI.2002.258308
  • Filename
    4027689
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3623791