DocumentCode
3624478
Title
Leakage characteristics of advanced MOS capacitors with hafnium silicate dielectric and Ru electrode
Author
M. Tapajna;K. Husekova;K. Frohlich;E. Dobrocka;F. Roozeboom
Author_Institution
Institute of Electrical Engineering, Centre of Excellence CENG, SAS, D?bravsk? cesta 9, 841 04 Bratislava, Slovakia
fYear
2006
Firstpage
21
Lastpage
24
Abstract
The authors have studied the leakage characteristics of Ru/HfxSi 1-xOy/Si MOS capacitors projected for advanced CMOS gate technology. Prior to Ru gate electrode deposition, the gate dielectrics were annealed by RTA in the temperature range of 700 - 1000 degC in O2. The influence of RTA has been analyzed by X-ray diffraction, X-ray reflectivity and capacitance-voltage techniques. RTA at temperatures ranging from 800 - 900 degC improves the leakage characteristics. Presumably, the Pool-Frenkel mechanism controls the current flow through the oxide with Ru electrode
Keywords
"MOS capacitors","Hafnium","Dielectrics","Electrodes","CMOS technology","Temperature distribution","Annealing","X-ray diffraction","Reflectivity","Capacitance-voltage characteristics"
Publisher
ieee
Conference_Titel
Advanced Semiconductor Devices and Microsystems, 2006. ASDAM ´06. International Conference on
Print_ISBN
1-4244-0369-0
Type
conf
DOI
10.1109/ASDAM.2006.331144
Filename
4133068
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